| Project | Prototype | Mass production |
|---|---|---|
| Materials : | FR4,Polymide | FR4,Polymide |
| Layers: | 2-16L | 2-10L |
| Max board size: | 500x700mm | 500x700mm |
| Max. board thickness: | 2.5mm | 3.0mm |
| Min. thickness of PI: | 0.03mm | 0.025mm |
| Inner layer Min.line Width/Space: | 2.5/2.5mil | 3.0/3.0mil |
| Minimum Line Width & Spacing | 3/3mil | 3.5/3.5mil |
| Minimum Mechamical Drilling | 0.12mm | 0.15mm |
| Aspect ratio: | 10:1 | 8:1 |
| Minimum Laser Drilling: | 0.075mm | 0.1mm |
| Minimum BGA Distance: | 0.35mm | 0.35mm |
| Minimum SMT Pad distance: | 0.15mm | 0.2mm |
| Minimum soldermask bridge: | 0.075mm | 0.1mm |
| HDI Steps | HDI Anylayer | HDI 3+N+3 |
| Surface Treatment: | ENIG, HAL LF, OSP, Immersioin Ag, Gold plating | ENIG, HAL LF, OSP, Immersioin Ag, Gold plating |
