Flex-Rigid PCB Capability
ProjectPrototypeMass production
Materials :FR4,PolymideFR4,Polymide
Layers:

2-16L

2-10L

Max board size:

500x700mm

500x700mm

Max. board thickness:

2.5mm

3.0mm

Min. thickness of PI:

0.03mm

0.025mm

Inner layer Min.line Width/Space: 

2.5/2.5mil

3.0/3.0mil

Minimum Line Width &  Spacing

3/3mil

3.5/3.5mil

Minimum Mechamical Drilling

0.12mm

0.15mm
Aspect ratio:

 10:1

8:1
Minimum Laser Drilling:

0.075mm

0.1mm 
Minimum BGA Distance:

0.35mm

0.35mm
Minimum SMT Pad distance:

0.15mm

0.2mm
Minimum soldermask bridge:

0.075mm

0.1mm 
HDI Steps

HDI Anylayer

HDI 3+N+3
Surface Treatment:

ENIG,  HAL LF,  OSP, Immersioin Ag,   Gold plating

ENIG,  HAL LF,  OSP, Immersioin Ag,   Gold plating