| Project | Prototype | Mass production |
|---|---|---|
| Layers | 2-32L ( HDI Anylayer ) | 1-18L ( HDI 3+N+3 ) |
| Base Material | FR-4, Aluminum (Shengyi, KB, ILM,ITEQ, Ventec, Rogers etc) | FR4, RO4003/4350/3003, Panasonic M6, ISOLA 406/410,Ventec etc |
| Acceptable files/datas | Gerber 274, Gerber D, Eagle, DPF, MDA, DXF Protel99se, ODB++, IPC-D-350 | Gerber 274, Gerber D, Eagle, DPF, MDA, DXF Protel99se, ODB++, IPC-D-350 |
| Twist & Warp | Double side multi-layers D≤0.075% | Double side multi-layers D≤0.075% |
| Layer Registration Tolerance | >=2mil | >=3mil |
| Max.board size | 600*1500MM | 600*1200MM |
| Min. Board size | 10*5mm(Thickness>0.4mm) | 10*10mm(Thickness>0.4mm) |
| Finished thickness | 1/2Layer:0.25-4.5mm(min:0.6mm for HAL) | 1/2Layer: 0.4-3.5mm(min:0.6mm for HAL) |
| Ratio Rate | 1:12 | 1:8 |
| Hole Size tolerance | PTH：0.075mm NPTH：0.05mm | PTH：0.075mm NPTH：0.05mm |
| Hole location tolerance | PTH：0.05mm NPTH：0.05mm | PTH：0.075mm NPTH：0.075mm |
| Mechamical Drilling | 0.15mm-6.0mm | 0.15mm-6.0mm |
| Laser Drilling | 0.075mm (3mil) | 0.1mm (4mil) |
| Outline tolerance | Punching: +/-0.1MM Routing: +/-0.13MM V-CUT: +/-0.1MM Depth routing:+/-0.1MM Beveling: +/-0.1MM | Punching: +/-0.1MM Routing: +/-0.13MM V-CUT: +/-0.1MM Depth routing:+/-0.1MM Beveling: +/-0.1MM |
| Board thickness tolerance | ≤20mil : ±3mil（2L） | ≤20mil : ±3mil（2L） 20mil＜x＜62mil : ±4mil（2L,Multilayer） ＜62mil : ±10%（2L,Multilayer） |
| Min.Line width/space (Finished) | 1/3OZ : 2.5/2.5mil(min) H/Hoz : 3.0/3.0mil(min) 1/1oz :3.0/3.5mil(min) 2/2oz : 5.0/4.0mil(min) 3/3oz : 7.0/5.0mil(min) | 1/3OZ : 2.5/2.5mil(min) H/Hoz : 3.0/3.0mil(min) 1/1oz : 4/4.0mil(min) 2/2oz : 6.0/5.0mil(min) 3/3oz : 8.0/6.0mil(min) |
| Surface treatment | HAL (Lead Free),ENIG, Immersion Ag/Tin,OSP, Gold plating | HAL (Lead Free),ENIG, Immersion Ag/Tin,OSP, Gold plating |
| Impedence | Single : 50-90 ohm+/-10% Difference: 60-120 ohm+/-10% | Single : 50-100 ohm+/-10% Difference: 60-120 ohm+/-10% |
